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Inventor

Hideki Harano

Inventor
Gunma, JP

Overview

4→
Patents
2002–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
F25BRefrigeration machines, plants or systems14%
H01JElectric discharge tubes or discharge lamps14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
PatentTitleYear
9,972,591Method of manufacturing semiconductor device20189,536,849'Semiconductor device and manufacturing method of the same'20176,843,069'Etching apparatus'20056,475,334'Dry etching device and dry etching method'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002Patents assigned to NEC CORP (1)· patent assignee history
2002Based in Tokyo, JP· patent location history
2005Patents assigned to NEC ELECTRONICS CORP (1)· patent assignee history
2005Based in Kanagawa, JP· patent location history
2017–2018Patents assigned to RENESAS ELECTRONICS CORP (2)· patent assignee history
2017–2018Based in Gunma, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
RENESAS ELECTRONICS CORP22017–2018
NEC CORP12002
NEC ELECTRONICS CORP12005
Locations
LocationPatentsSpan
Gunma, JP22017–2018
Kanagawa, JP12005
Tokyo, JP12002