Inventor
Koji Futatsumori
Inventor
Annaka, JP
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Lprimary
C08LCompositions of macromolecular compounds22%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds21%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients15%
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
H01BCables3%
H05KPrinted circuits3%
H10HInorganic light-emitting semiconductor devices having potential barriers3%
C03CChemical composition of glasses, glazes or vitreous enamels1%
C08JWorking-up1%
PatentTitleYear
7,534,840'Room temperature-curable organopolysiloxane compositions'20095,994,785'Epoxy resin compositions and semiconductor devices encapsulated therewith'19995,473,091'Quaternary phosphorus compounds and their preparation'19955,362,775'Epoxy resin composition and cured product thereof'19945,362,887'Fluorine - modified acid anhydrides'19945,336,786'Organic silicon compounds'19945,248,710'Flip chip encapsulating compositions and semiconductor devices encapsulated therewith'19935,235,005'Polyimide resin composition and semiconductor device encapsulated therewith'19935,198,479'Light transmissive epoxy resin compositions and optical semiconductor devices encapsulated therewith'19935,175,199'High transparency silica-titania glass beads, method for making, and light transmission epoxy resin compositions'19925,166,228'Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith'19925,137,940'Semiconductor encapsulating epoxy resin compositions'19925,053,445'Epoxy resin composition'19915,006,614'Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer'19914,891,434'Novel organosilicon compound'19904,877,822'Epoxy resin composition'19894,761,454'Method for the preparation of fine spherical particles of silicone elastomer'19884,701,482'Epoxy resin composition for encapsulation of semiconductor devices'19874,618,646'Room temperature-curable organopolysiloxane composition'19864,579,963'Organosilicon compound and a room temperature curable organopolysiloxane composition formulated therewith'19864,577,041'Cyclic organopolysiloxane compound'19864,339,563'Novel organopolysiloxanes and room temperature curable organopolysiloxane compositions containing the same'19824,323,488'Method for the preparation of silicone-modified polyoxyalkylene polyethers and room temperature-curable compositions therewith'19824,304,920'Novel organosilane compounds'19814,302,571'Room temperature-curable polyoxyalkylene polyether compositions'19814,294,975'Hydroalkenyloxysilanes'19814,288,375'Novel organosilane compounds'1981Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1981–2009Patents assigned to SHINETSU CHEMICAL CO (27)· patent assignee history
1981–2009Based in Annaka, JP· patent location history
1986–1995Based in Gunma, JP· patent location history
1994Patents assigned to NIPPON DENSO CO (1)· patent assignee history
1999Patents assigned to MITSUBISHI ELECTRIC CORP (1)· patent assignee history
1999Based in Shah Alam, MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINETSU CHEMICAL CO | 27 | 1981–2009 |
| MITSUBISHI ELECTRIC CORP | 1 | 1999 |
| NIPPON DENSO CO | 1 | 1994 |
Locations
| Location | Patents | Span |
|---|---|---|
| Annaka, JP | 20 | 1981–2009 |
| Gunma, JP | 6 | 1986–1995 |
| Shah Alam, MY | 1 | 1999 |