Inventor
BYUNG WOO KANG
Inventor
KR
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Gprimary
H01GCapacitors29%
G02BOptical elements, systems or apparatus13%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them12%
H04NPictorial communication, e.g. television10%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution9%
H10BElectronic memory devices6%
H01LSemiconductor devices4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
H01FMagnets3%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
12,592,340Multilayer electronic component202612,444,538Multilayer electronic component having external electrode which includes resin layer and conductive resin layer202512,408,348Semiconductor device and manufacturing method thereof202512,360,387Camera module202512,360,388Camera module202512,334,268Multilayer electronic component202512,283,431Multilayer electronic component202512,266,479Multilayer electronic component including non-conductive resin layer on body thereof202512,068,110Multilayer electronic component202412,025,851Camera module202412,009,154Multilayer electronic component with conductive resin layer202411,947,132Camera module202411,935,703Multilayer electronic component including non-conductive resin layer on body thereof202411,874,594Camera module202411,823,844Capacitor component202311,817,269Multilayer capacitor202311,817,251Electronic component202311,817,267Multilayer capacitor202311,804,332Multilayered electronic component202311,798,747Multilayer electronic component202311,694,844Multilayer electronic component202311,636,984Multilayer electronic component including non-conductive resin layer on body thereof202311,587,941Method of planarizing insulating layer for memory device202311,574,920Semiconductor device and manufacturing method of semiconductor device202311,570,345Camera module202311,562,859MLCC module and method of manufacturing the same202311,513,308Camera module202211,508,522Multilayer electronic component202211,469,051Multilayer capacitor and board having the same mounted thereon202211,393,630Multilayer electronic component including non-conductive resin layer on body thereof202211,362,104Semiconductor memory device202211,347,134Camera module202211,209,663Camera module202111,183,331MLCC module and method of manufacturing the same202111,183,325Electronic component2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to SAMSUNG ELECTRO MECH (31)· patent assignee history
2021–2026Based in KR· patent location history
2022–2025Patents assigned to SK HYNIX INC (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRO MECH | 31 | 2021–2026 |
| SK HYNIX INC | 4 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 35 | 2021–2026 |