Inventor
BYUNG HO LEE
Inventor
KR
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
A61KPreparations for medical, dental or toiletry purposes11%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations11%
C07DHeterocyclic compounds11%
H10DInorganic electric semiconductor devices11%
C04BLime, magnesia6%
H01GCapacitors6%
H10BElectronic memory devices6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
12,588,565Semiconductor device including bonding pads and method for fabricating the same202612,525,560Semiconductor device including bonding pad202612,374,500Multilayer electronic component202512,368,071Semiconductor device and method for fabricating the same202512,195,469Compounds having PDE9A inhibitory activity, and pharmaceutical uses thereof202512,187,729Compounds having PDE9A inhibitory activity, and pharmaceutical uses thereof2025Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2025–2026Patents assigned to SK HYNIX INC (3)· patent assignee history
2025Patents assigned to KOREA RES INST CHEMICAL TECH (2)· patent assignee history
2025Patents assigned to SAMSUNG ELECTRO MECH (1)· patent assignee history
2025–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SK HYNIX INC | 3 | 2025–2026 |
| KOREA RES INST CHEMICAL TECH | 2 | 2025 |
| SAMSUNG ELECTRO MECH | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 6 | 2025–2026 |