Inventor
Takamasa Iwai
Inventor
Tokyo, JP
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
10,431,528Semiconductor device2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019Patents assigned to MITSUBISHI ELECTRIC CORP (1)· patent assignee history
2019Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 1 | 2019 |