LexDanaLexDanabeta
Inventor

Kota Kikuchi

Inventor
Tokyo, JP

Overview

3→
Patents
2018–2019
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering25%
B05CApparatus for applying fluent materials to surfaces, in general17%
C23CCoating metallic material17%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables8%
H01LSemiconductor devices8%
H05KPrinted circuits8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
Y10TTechnical subjects covered by former us classification8%
PatentTitleYear
10,391,589Flux applying device201910,137,538Liquid coating device20189,956,634Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018–2019Patents assigned to SENJU METAL INDUSTRY CO (3)· patent assignee history
2018–2019Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SENJU METAL INDUSTRY CO32018–2019
Locations
LocationPatentsSpan
Tokyo, JP32018–2019