Inventor
Chu-Chin Hu
Inventor
Hsinchu County, TW
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H01LSemiconductor devices21%
H05KPrinted circuits16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
G06KGraphical data reading3%
G06VImage or video recognition or understanding3%
A61BDiagnosis2%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution2%
PatentTitleYear
10,996,558Multiple-mask multiple-exposure lithography and masks202110,937,743Mixing organic materials into hybrid packages202110,930,580Semiconductor device and method of manufacture202110,784,205Electronic package202010,580,739Package substrate and associated fabrication method with varying depths for circuit device terminals202010,204,865Electronic package and conductive structure thereof201910,079,220Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding201810,002,823Packaging substrate and method of fabricating the same20189,831,217Method of fabricating package substrates20179,754,982'Packaging module and substrate structure thereof'20179,613,894'Electronic package'20179,601,402'Package apparatus and manufacturing method thereof'20179,589,935'Package apparatus and manufacturing method thereof'20179,357,647'Packaging substrate, method for manufacturing same, and chip packaging body having same'20168,531,021'Package stack device and fabrication method thereof'20138,354,338'Carrier board structure with embedded semiconductor chip and fabrication method thereof'20138,222,080'Fabrication method of package structure'20127,417,299'Direct connection multi-chip semiconductor element structure'20087,319,276'Substrate for pre-soldering material and fabrication method thereof'20087,190,592'Integrated library core for embedded passive components and method for forming electronic device thereon'20077,112,524'Substrate for pre-soldering material and fabrication method thereof'20066,576,541'Method and structure for producing bumps on an IC package substrate'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2008Patents assigned to PHOENIX PREC TECHNOLOGY CORP (5)· patent assignee history
2003–2021Based in Hsinchu, TW· patent location history
2012–2013Patents assigned to HU CHU-CHIN (3)· patent assignee history
2012–2016Based in Taoyuan, TW· patent location history
2017–2020Patents assigned to PHOENIX PIONEER TECHNOLOGY CO LTD (8)· patent assignee history
2017–2020Based in Hsinchu County, TW· patent location history
2018–2020Patents assigned to PHOENIX & CORP (3)· patent assignee history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
2021Based in Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PHOENIX PIONEER TECHNOLOGY CO LTD | 8 | 2017–2020 |
| PHOENIX PREC TECHNOLOGY CORP | 5 | 2003–2008 |
| HU CHU-CHINself | 3 | 2012–2013 |
| PHOENIX & CORP | 3 | 2018–2020 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 3 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu County, TW | 10 | 2017–2020 |
| Hsinchu, TW | 7 | 2003–2021 |
| Taoyuan, TW | 3 | 2012–2016 |
| Taipei, TW | 2 | 2021 |