Inventor
Raymond Albert Fillion
Inventor
Niskayuna, NY, US
Overview
Patents· 54 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
H01LSemiconductor devices16%
Y10TTechnical subjects covered by former us classification7%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation6%
H05KPrinted circuits4%
G01RMeasuring electric variables2%
H01JElectric discharge tubes or discharge lamps2%
H10DInorganic electric semiconductor devices2%
H10HInorganic light-emitting semiconductor devices having potential barriers2%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
PatentTitleYear
10,892,231Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof202110,838,059Acoustic phased array antenna with isotropic and non-isotropic radiating elements202010,804,115Electronics package with integrated interconnect structure and method of manufacturing thereof202010,804,116Electronics package with integrated interconnect structure and method of manufacturing thereof202010,692,737Multilayer interconnect structure with buried conductive via connections and method of manufacturing thereof202010,566,301Semiconductor logic device and system and method of embedded packaging of same202010,541,209Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof202010,541,153Electronics package with integrated interconnect structure and method of manufacturing thereof202010,504,826Device almost last embedded device structure and method of manufacturing thereof201910,497,648Embedded electronics package with multi-thickness interconnect structure and method of making same201910,396,053Semiconductor logic device and system and method of embedded packaging of same201910,332,832Method of manufacturing an electronics package using device-last or device-almost last placement201910,276,523Semiconductor logic device and system and method of embedded packaging of same201910,211,141Semiconductor logic device and system and method of embedded packaging of same20199,953,913Electronics package with embedded through-connect structure and method of manufacturing thereof20189,953,910Demountable interconnect structure20189,953,917Electronics package with embedded through-connect and resistor structure and method of manufacturing thereof20189,610,758'Method of making demountable interconnect structure'20179,000,496'Source bridge for cooling and/or external connection'20158,674,212'Solar cell and magnetically self-assembled solar cell assembly'20148,498,131'Interconnect structure'20138,466,007'Power semiconductor module and fabrication method'20138,259,454'Interconnect structure including hybrid frame panel'20128,049,338'Power semiconductor module and fabrication method'20118,008,781'Apparatus and method for reducing pitch in an integrated circuit'20117,964,974'Electronic chip package with reduced contact pad pitch'20117,956,457'System and apparatus for venting electronic packages and method of making same'20117,829,386'Power semiconductor packaging method and structure'20107,550,097'Thermal conductive material utilizing electrically conductive nanoparticles'20097,303,947'Source bridge for cooling and/or external connection'20077,262,444'Power semiconductor packaging method and structure'20076,933,813'Interconnection structure with etch stop'20056,671,948'Interconnection method using an etch stop'20046,507,113'Electronic interface structures and methods of fabrication'20036,396,153'Circuit chip package and fabrication method'20026,306,680'Power overlay chip scale packages for discrete power devices'20016,242,282'Circuit chip package and fabrication method'20016,239,980'Multimodule interconnect structure and process'20016,239,482'Integrated circuit package including window frame'20015,946,546'Chip burn-in and test structure and method'19995,888,837'Chip burn-in and test structure and method'19995,703,440'Compact fluorescent lamp and ballast arrangement with inductor directly between lamp ends'19975,691,598'Fluorescent lamp with thermal heat shield between lamp tube and ballast circuitry'19975,637,922'Wireless radio frequency power semiconductor devices using high density interconnect'19975,532,512'Direct stacked and flip chip power semiconductor device structures'19965,527,741'Fabrication and structures of circuit modules with flexible interconnect layers'19965,497,033'Embedded substrate for integrated circuit modules'19965,455,459'Reconstructable interconnect structure for electronic circuits'19955,422,513'Integrated circuit chip placement in a high density interconnect structure'19955,353,498'Method for fabricating an integrated circuit module'19945,353,195'Integral power and ground structure for multi-chip modules'19945,324,987'Electronic apparatus with improved thermal expansion match'19945,315,486'Hermetically packaged HDI electronic system'19945,291,066'Moisture-proof electrical circuit high density interconnect module and method for making same'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2021Patents assigned to GEN ELECTRIC (46)· patent assignee history
1994–2021Based in Niskayuna, NY, US· patent location history
1994–2001Based in Schenectady, NY, US· patent location history
1995–1996Patents assigned to MARTIN MARIETTA CORP (4)· patent assignee history
2012–2020Patents assigned to FILLION RAYMOND ALBERT (8)· patent assignee history
2013–2018Patents assigned to WOYCHIK CHARLES GERARD (3)· patent assignee history
2013Patents assigned to DUROCHER KEVIN MATTHEW (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GEN ELECTRIC | 46 | 1994–2021 |
| FILLION RAYMOND ALBERTself | 8 | 2012–2020 |
| MARTIN MARIETTA CORP | 4 | 1995–1996 |
| WOYCHIK CHARLES GERARD | 3 | 2013–2018 |
| DUROCHER KEVIN MATTHEW | 2 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Niskayuna, New York, US | 49 | 1994–2021 |
| Schenectady, New York, US | 5 | 1994–2001 |