Inventor
Takuji Okeyui
Inventor
Ibaraki, JP
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
Y10TTechnical subjects covered by former us classification8%
A47HFurnishings for windows or doors6%
B08BCleaning in general6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
H05KPrinted circuits6%
B62BHand-propelled vehicles, e.g. hand carts or perambulators3%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%
PatentTitleYear
8,525,351'Semiconductor device, substrate for producing semiconductor device and method of producing them'20138,018,044'Semiconductor device, substrate for producing semiconductor device and method of producing them'20117,943,427'Semiconductor device, substrate for producing semiconductor device and method of producing them'20117,862,954'Fuel cell'20117,365,441'Semiconductor device fabricating apparatus and semiconductor device fabricating method'20087,262,514'Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device'20077,235,888'Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device'20077,132,755'Adhesive film for manufacturing semiconductor device'20067,064,011'Semiconductor device fabricating apparatus and semiconductor device fabricating method'20066,858,473'Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device'20056,565,704'Process for the removal of resist material'20036,373,000'Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board'20026,335,076'Multi-layer wiring board and method for manufacturing the same'20026,333,469'Wafer-scale package structure and circuit board attached thereto'20016,245,188'Process for the removal of resist material'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2013Patents assigned to NITTO DENKO CORP (14)· patent assignee history
2001–2003Based in Osaka, JP· patent location history
2005–2013Based in Ibaraki, JP· patent location history
2008–2013Patents assigned to DAINIPPON PRINTING CO LTD (4)· patent assignee history
2011Patents assigned to AQUAFAIRY CORP (1)· patent assignee history
2013Patents assigned to HOSOKAWA KAZUHITO (1)· patent assignee history
2013Patents assigned to IKEMURA KAZUHIRO (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 14 | 2001–2013 |
| DAINIPPON PRINTING CO LTD | 4 | 2008–2013 |
| AQUAFAIRY CORP | 1 | 2011 |
| HOSOKAWA KAZUHITO | 1 | 2013 |
| IKEMURA KAZUHIRO | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 10 | 2005–2013 |
| Osaka, JP | 5 | 2001–2003 |