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Inventor

Kiyoshi Nishioka

Inventor
Hyogo, JP

Overview

18→
Patents
1994–2020
Patent span
Chemistry
Primary field (CPC C)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds13%
H01LSemiconductor devices12%
H10DInorganic electric semiconductor devices12%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
C08LCompositions of macromolecular compounds10%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients6%
C09DCoating compositions, e.g. paints, varnishes or lacquers4%
C01GCompounds containing metals not covered by subclasses c01d or c01f3%
H05KPrinted circuits3%
B29CShaping or joining of plastics1%
PatentTitleYear
10,787,540Aliphatic polycarbonate and binder resin composition containing said polycarbonate202010,784,120Laminate, etching mask, method of producing laminate, method of producing etching mask, and method of producing thin film transistor202010,759,901Thermally decomposable binder202010,756,383All solid state secondary-battery additive, all-solid-state secondary battery, and method for producing same202010,749,034Semiconductor device, method for producing same and aliphatic polycarbonate202010,640,643Pyrolytic binder202010,634,996Composite member and method of manufacturing the same, and aliphatic polycarbonate-containing layer202010,457,607Binder resin composition201910,450,485Pressure sensitive adhesive sheet201910,400,336Oxide precursor, oxide layer, semiconductor element, and electronic device, and method of producing oxide layer and method of producing semiconductor element201910,340,388Intermediate semiconductor device having an aliphatic polycarbonate layer201910,113,061Polyester resin composition and molding20189,985,137Semiconductor device having a decomposed aliphatic polycarbonate layer20189,842,916'Oxide semiconductor layer and production method therefor, oxide semiconductor precursor, oxide semiconductor layer, semiconductor element, and electronic device'20179,783,665'Polyolefin-based resin composition'20179,552,985'Oxide semiconductor layer and production method therefor, oxide semiconductor precursor, oxide semiconductor layer, semiconductor element, and electronic device'20176,638,473'Cooling device for blast furnace bottom wall bricks'20035,357,443'Method of estimating properties of steel product'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2003Patents assigned to NIPPON STEEL CORP (2)· patent assignee history
1994Based in Kimitsu, JP· patent location history
2003Based in Kitakyushu, JP· patent location history
2017–2020Patents assigned to SUMITOMO SEIKA CHEMICALS (16)· patent assignee history
2017–2020Patents assigned to JAPAN ADVANCED INSTITUTE OF SCIENCE AND TECH (7)· patent assignee history
2017–2020Based in Hyogo, JP· patent location history
2017–2020Based in Himeji, JP· patent location history
2018Patents assigned to ADVANCED SOFTMATERIALS INC (1)· patent assignee history
2019–2020Based in Kobe, JP· patent location history
2020Patents assigned to NATIONAL UNIV CORPORATION TOKYO UNIV OF AGRICULTURE AND TECHNOLOGY (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SUMITOMO SEIKA CHEMICALS162017–2020
JAPAN ADVANCED INSTITUTE OF SCIENCE AND TECH72017–2020
NATIONAL UNIV CORPORATION TOKYO UNIV OF AGRICULTURE AND TECHNOLOGY32020
NIPPON STEEL CORP21994–2003
ADVANCED SOFTMATERIALS INC12018
Locations
LocationPatentsSpan
Hyogo, JP102017–2020
Himeji, JP42017–2020
Kobe, JP22019–2020
Kitakyushu, JP12003
Kimitsu, JP11994