LexDanaLexDanabeta
Inventor

Toshihiko Kariya

Inventor
Nagoya, JP

Overview

30→
Patents
2000–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 30 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics55%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts19%
B29BPreparation or pretreatment of the material to be shaped11%
B22DCasting of metals8%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers2%
F15BSystems acting by means of fluids in general2%
G06FElectric digital data processing2%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
10,946,570Injection molding method and injection molding machine202110,926,436Injection molding method and injection molding machine202110,766,178Screw for injection molding machine, injection molding machine, and injection molding method202010,525,623Mold opening/closing device202010,486,351Screw, injection molding machine, and injection molding method201910,464,246Injection molding method201910,338,771Control device for injection molding machine and screen display method20199,821,498'Injection molding method and injection molding device'20179,789,639'Mold-clamping device, injection-molding device, and method for opening and closing mold'20179,713,892'Injection foam molding machine'20179,669,573'Injection molding apparatus and injection molding method'20179,441,643'Hydraulic oil storage device and injection molding device'20169,333,690'Method for manufacturing a fiber-reinforced composite material'20169,254,600'Injection foam molding machine'20169,085,103'Plasticizing screw for injection molding and injection molding method using same'20159,011,750'Injection molding device and method for discharging heat medium for injection molding device'20158,932,506'Resin injection molding method'20158,900,506'Plasticizing screw for injection molding and injection molding method using same'20148,741,193'Injection molding method, molded-article producing method, and injection molding apparatus'20148,641,400'Mold clamping apparatus'20148,550,800'Injection molding machine for two-material molding'20138,460,586'Injection molding method and apparatus for controlling a mold temperature and displacement of an injection screw'20138,366,438'Mold clamping device'20138,360,766'Injection molding machine and injection molding method'20138,318,061'Mold temperature control circuit of injection molding device and method for discharging heating medium'20128,163,218'Injection molding machine for two-material molding and method of controlling the same'20128,043,538'Mold temperature control circuit of injection molding device and method for discharging heating medium'20118,043,537'Injection molding system, computer program, method of injection molding, and injection molding machine'20116,206,559'Plasticating screw'20016,045,348'Hopper structure for feeding powdery materials'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2021Patents assigned to MITSUBISHI HEAVY IND LTD (9)· patent assignee history
2000–2020Based in Aichi, JP· patent location history
2011–2021Based in Nagoya, JP· patent location history
2012–2016Patents assigned to KARIYA TOSHIHIKO (14)· patent assignee history
2012–2016Patents assigned to MITSUBISHI HEAVY IND PLASTIC T (12)· patent assignee history
2013–2016Patents assigned to TODA NAOKI (6)· patent assignee history
2015Based in Tokyo, JP· patent location history
2019–2021Patents assigned to U MHI PLATECH CO LTD (6)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KARIYA TOSHIHIKOself142012–2016
MITSUBISHI HEAVY IND PLASTIC T122012–2016
MITSUBISHI HEAVY IND LTD92000–2021
TODA NAOKI62013–2016
U MHI PLATECH CO LTD62019–2021
Locations
LocationPatentsSpan
Nagoya, JP212011–2021
Aichi, JP82000–2020
Tokyo, JP12015