Inventor
Sao-Hsia Tang
Inventor
Hsinchu, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits46%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
Y10TTechnical subjects covered by former us classification23%
C25DProcesses for the electrolytic or electrophoretic production of coatings8%
PatentTitleYear
8,164,003'Circuit board surface structure and fabrication method thereof'20127,350,298'Method for fabricating circuit board with conductive structure'20087,341,934'Method for fabricating conductive bump of circuit board'20087,253,364'Circuit board having electrically conductive structure formed between circuit layers thereof and method for fabricating the same'20077,174,630'Method for fabricating connection terminal of circuit board'20077,151,050'Method for fabricating electrical connection structure of circuit board'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2008Patents assigned to PHOENIX PREC TECHNOLOGY CORP (5)· patent assignee history
2006–2012Based in Hsinchu, TW· patent location history
2012Patents assigned to TANG SAO-HSIA (1)· patent assignee history
2012Patents assigned to UNIMICRON TECHNOLOGY CORP (1)· patent assignee history
2012Patents assigned to WANG YING-TUNG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PHOENIX PREC TECHNOLOGY CORP | 5 | 2006–2008 |
| TANG SAO-HSIAself | 1 | 2012 |
| UNIMICRON TECHNOLOGY CORP | 1 | 2012 |
| WANG YING-TUNG | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 6 | 2006–2012 |