Inventor

MING-HUA HO

Inventor
TW

Overview

3→
Patents
2021–2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics17%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering17%
F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges17%
G06FElectric digital data processing17%
H04MTelephonic communication17%
H05KPrinted circuits17%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2024Patents assigned to PEGATRON CORP (2)· patent assignee history
2021–2024Based in TW· patent location history
2024Patents assigned to UNIV NAT TAIWAN SCIENCE & TECHNOLOGY (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PEGATRON CORP22021–2024
UNIV NAT TAIWAN SCIENCE & TECHNOLOGY12024
Locations
LocationPatentsSpan
TW32021–2024