Inventor

Byung-Kwon Cho

Inventor

Suwon-si, KR

Overview

16→

Patents

2014–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 16 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices30%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%

H10DInorganic electric semiconductor devices18%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%

LOC095%

A61FFilters implantable into blood vessels3%

B08BCleaning in general3%

B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers3%

F25DRefrigerators3%

Y02WClimate change mitigation technologies related to wastewater treatment or waste management3%

PatentTitleYear

10,985,036Substrate processing apparatus and apparatus for manufacturing integrated circuit device2021 10,818,522Process chamber for a supercritical process and apparatus for treating substrates having the same2020 10,192,973Methods of forming semiconductor devices including trench walls having multiple slopes2019 10,186,485Planarized interlayer dielectric with air gap isolation2019 9,984,921Semiconductor device and method of manufacturing the same2018 9,929,099'Planarized interlayer dielectric with air gap isolation'2018 9,812,353'Semiconductor device and method of manufacturing the same'2017 9,443,979'Semiconductor devices including trench walls having multiple slopes'2016 9,334,087'Standing pouch'2016 9,117,692'Semiconductor device having dual metal silicide layers and method of manufacturing the same'2015 9,040,415'Semiconductor device and method of fabricating the same'2015 8,946,026'Methods of fabricating a semiconductor device including metal gate electrodes'2015 8,889,552'Semiconductor device having dual metal silicide layers and method of manufacturing the same'2014 8,735,239'Semiconductor devices including compressive stress patterns and methods of fabricating the same'2014 D0705061'Spout cap'2014 D0705062'Spout cap'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2021Patents assigned to SAMSUNG ELECTRONICS CO LTD (13)· patent assignee history

2014–2016Patents assigned to CHO BYUNG-KWON (5)· patent assignee history

2014–2016Patents assigned to HARVEST CHARMFOODS CO LTD (3)· patent assignee history

2014Patents assigned to KRAUZEN CO LTD (2)· patent assignee history

2014–2015Patents assigned to YOON BOUN (2)· patent assignee history

2014–2021Based in Suwon-si, KR· patent location history

2014–2016Based in Seoul, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SAMSUNG ELECTRONICS CO LTD	13	2014–2021
CHO BYUNG-KWONself	5	2014–2016
HARVEST CHARMFOODS CO LTD	3	2014–2016
KRAUZEN CO LTD	2	2014
YOON BOUN	2	2014–2015

Locations

Location	Patents	Span
Suwon-si, KR	13	2014–2021
Seoul, KR	3	2014–2016