Inventor
Jian Wu
Inventor
Shanghai, CN
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
A61Kprimary
A61KPreparations for medical, dental or toiletry purposes15%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations13%
C07DHeterocyclic compounds13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
H01LSemiconductor devices9%
C07KPeptides7%
B29CShaping or joining of plastics4%
H10DInorganic electric semiconductor devices4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
10,844,051Substituted oxazoles for the treatment of cancer202010,784,150Semiconductor structure and manufacturing method thereof202010,580,694Contact structure and method of forming the same202010,351,594Process for preparing compounds having triple activities of thrombolysis, antithrombosis, and radical scavenging201910,292,973Covalent irreversible inhibitors of USP7 as anti-cancer agents201910,276,427Semiconductor structure and manufacturing method thereof20199,984,918Semiconductor structure and manufacturing method thereof20189,890,193'Compounds having triple activities of thrombolysis, antithrombosis, and radical scavenging, synthesis, and use thereof'20189,717,717'Methods of treating cancer through the inhibition of USP7 and immune system modulation'20179,139,592'Modulators of Nrf2 and uses thereof'20158,796,664'Graphene-based composite structure and method for making the same'20148,470,889'Hybrid-ionone and curcumin molecules as anticancer agents'20137,250,395'Antagonist peptides to VEGF receptor Flt-1'20076,988,879'Apparatus and method for reducing substrate warpage'20066,986,197'Method of manufacturing an IC package'20066,869,556'Molding system for semiconductor packages'20056,808,661'Method for encapsulating leadframe-mounted integrated circuits'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2006Patents assigned to ASM TECH SINGAPORE PTE LTD (4)· patent assignee history
2004–2006Based in Singapore, SG· patent location history
2007–2019Based in Beijing, CN· patent location history
2013–2015Patents assigned to BATIST GERALD (2)· patent assignee history
2013–2015Based in Montreal, CA· patent location history
2017–2019Patents assigned to PROGENRA INC (2)· patent assignee history
2017–2019Based in Chester Springs, PA, US· patent location history
2018–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
2018–2019Patents assigned to SHANGHAI LUMOSA THERAPEUTICS CO LTD (2)· patent assignee history
2018–2020Based in Shanghai, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ASM TECH SINGAPORE PTE LTD | 4 | 2004–2006 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 3 | 2018–2020 |
| BATIST GERALD | 2 | 2013–2015 |
| PROGENRA INC | 2 | 2017–2019 |
| SHANGHAI LUMOSA THERAPEUTICS CO LTD | 2 | 2018–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shanghai, CN | 4 | 2018–2020 |
| Beijing, CN | 4 | 2007–2019 |
| Singapore, SG | 4 | 2004–2006 |
| Chester Springs, Pennsylvania, US | 2 | 2017–2019 |
| Montreal, CA | 2 | 2013–2015 |