Inventor
NORIFUMI KOHAMA
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
B23KSoldering or unsoldering7%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
C23CCoating metallic material7%
H01JElectric discharge tubes or discharge lamps7%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
12,322,599Substrate processing method, modification device and substrate processing system202511,721,596Parameter adjustment method of bonding apparatus and bonding system202311,574,808Plasma processing method and plasma processing apparatus202311,482,431Substrate processing apparatus and substrate processing method2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TOKYO ELECTRON LTD (4)· patent assignee history
2022–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO ELECTRON LTD | 4 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2022–2025 |