Inventor

Daniel N. Koury, Jr.

Inventor
Mesa, AZ, US

Overview

26→
Patents
1987–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 26 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Pprimary
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock23%
B81BMicrostructural devices or systems, e.g. micromechanical devices17%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems7%
Y10TTechnical subjects covered by former us classification7%
H02NElectric machines not otherwise provided for6%
G01CMeasuring distances, levels or bearings4%
H03BGeneration of oscillations, directly or by frequency-changing, by circuits employing active elements which operate in a non-switching manner4%
H03HImpedance networks, e.g. resonant circuits4%
H03LAutomatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses4%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
9,602,026'Temperature compensation for MEMS devices'20179,376,312'Method for fabricating a transducer apparatus'20169,377,487'Transducer structure and method for MEMS devices'20169,321,629'Method and structure for adding mass with stress isolation to MEMS structures'20169,300,227'Monolithic body MEMS devices'20169,246,412'Suspended passive element for MEMS devices'20168,710,597'Method and structure for adding mass with stress isolation to MEMS structures'20148,564,075'Package tolerate design and method'20138,553,389'Anchor design and method for MEMS transducer apparatuses'20138,477,473'Transducer structure and method for MEMS devices'20138,056,415'Semiconductor device with reduced sensitivity to package stress'20117,829,366'Microelectromechanical systems component and method of making same'20107,637,160'MEMS suspension and anchoring design'20097,628,072'MEMS device and method of reducing stiction in a MEMS device'20097,268,463'Stress release mechanism in MEMS device and method of making same'20076,936,492'Single proof mass, 3 axis MEMS transducer'20056,845,670'Single proof mass, 3 axis MEMS transducer'20056,465,320'Electronic component and method of manufacturing'20026,228,275'Method of manufacturing a sensor'20016,122,963'Electronic component for measuring acceleration'20006,018,998'Acceleration sensing device and method of operation and forming'20005,914,521'Sensor devices having a movable structure'19995,806,365'Acceleration sensing device on a support substrate and method of operation'19984,876,212'Process for fabricating complimentary semiconductor devices having pedestal structures'19894,757,029'Method of making vertical field effect transistor with plurality of gate input cnnections'19884,647,331'Method for assembling an electro-optical device'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–2002Patents assigned to MOTOROLA INC (9)· patent assignee history
1987–1988Based in Scottsdale, AZ, US· patent location history
1989Based in Ithaca, NY, US· patent location history
1998–2017Based in Mesa, AZ, US· patent location history
2005–2011Patents assigned to FREESCALE SEMICONDUCTOR INC (7)· patent assignee history
2011–2016Patents assigned to KOURY JR DANIEL N (6)· patent assignee history
2013–2016Patents assigned to MCUBE INC (7)· patent assignee history
2013Based in Cupertino, CA, US· patent location history
2016–2017Patents assigned to SILICON LAB INC (3)· patent assignee history
2016Based in Menlo Park, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MOTOROLA INC91987–2002
FREESCALE SEMICONDUCTOR INC72005–2011
MCUBE INC72013–2016
KOURY JR DANIEL Nself62011–2016
SILICON LAB INC32016–2017
Locations
LocationPatentsSpan
Mesa, AZ, US211998–2017
Scottsdale, AZ, US21987–1988
Menlo Park, California, US12016
Cupertino, California, US12013
Ithaca, New York, US11989