Inventor
NENG-KUO CHEN
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10DInorganic electric semiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
B24BMachines, devices, or processes for grinding or polishing6%
C09GPolishing compositions6%
C09KMaterials for miscellaneous applications, not provided for elsewhere6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
11,854,898Wrap-around contact on FinFET202311,784,183Inter-level connection for multi-layer structures202311,532,612Inter-level connection for multi-layer structures202211,362,000Wrap-around contact on FinFET202211,193,043System for chemical mechanical polishing of Ge-based materials and devices2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2023Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2021Patents assigned to UWIZ TECH CO LTD (1)· patent assignee history
2021–2023Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2021–2023 |
| UWIZ TECH CO LTD | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 5 | 2021–2023 |