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Inventor

Yu-Ying Lee

Inventor
Kaohsiung, TW

Overview

17→
Patents
2013–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 17 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H01LSemiconductor devices31%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems6%
H05KPrinted circuits6%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light2%
H10DInorganic electric semiconductor devices2%
H10HInorganic light-emitting semiconductor devices having potential barriers2%
PatentTitleYear
10,879,159Substrate, semiconductor package thereof and process of making same202010,741,482Semiconductor device package202010,734,337Semiconductor package device having glass transition temperature greater than binding layer temperature202010,665,765Semiconductor device package and a method of manufacturing the same202010,515,884Substrate having a conductive structure within photo-sensitive resin201910,483,196Embedded trace substrate structure and semiconductor package structure including the same201910,446,411Semiconductor device package with a conductive post201910,224,298Semiconductor package device having glass transition temperature greater than binding layer temperature201910,103,110Semiconductor package structure and fabrication method thereof201810,049,893Semiconductor device with a conductive post201810,049,976Semiconductor substrate and manufacturing method thereof201810,002,843Semiconductor substrate structure, semiconductor package and method of manufacturing the same20189,984,989Semiconductor substrate and semiconductor package structure20189,911,702'Semiconductor package structure and fabrication method thereof'20189,054,118'Heat dissipating semiconductor device packages and related methods'20158,779,581'Heat dissipating semiconductor device packages'20148,592,962'Semiconductor device packages with protective layer and related methods'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2020Patents assigned to ADVANCED SEMICONDUCTOR ENG (17)· patent assignee history
2013–2014Patents assigned to CHEN KUANG-HSIUNG (2)· patent assignee history
2013–2014Patents assigned to FENG HSIANG-MING (2)· patent assignee history
2013–2014Patents assigned to LEE YU-YING (2)· patent assignee history
2013–2014Patents assigned to WANG SHENG-MING (2)· patent assignee history
2013–2015Based in Taichung, TW· patent location history
2018–2020Based in Kaohsiung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ADVANCED SEMICONDUCTOR ENG172013–2020
CHEN KUANG-HSIUNG22013–2014
FENG HSIANG-MING22013–2014
LEE YU-YINGself22013–2014
WANG SHENG-MING22013–2014
Locations
LocationPatentsSpan
Kaohsiung, TW142018–2020
Taichung, TW32013–2015