LexDanaLexDanabeta
Inventor

Toshihisa Tanaka

Inventor
Yokohama, JP

Overview

20→
Patents
1995–2020
Patent span
Physics
Primary field (CPC G)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G11Bprimary
G11BInformation storage based on relative movement between record carrier and transducer17%
G01NInvestigating or analysing materials by determining their chemical or physical properties13%
B24BMachines, devices, or processes for grinding or polishing10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
Y10TTechnical subjects covered by former us classification10%
G02BOptical elements, systems or apparatus7%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them7%
B01LChemical or physical laboratory apparatus for general use3%
B60JWindows, windscreens, non-fixed roofs, doors, or similar devices for vehicles3%
D01FChemical features in the manufacture of artificial filaments, threads, fibres, bristles or ribbons3%
PatentTitleYear
10,801,929Specimen smearing apparatus, specimen smearing method, smear sample preparing apparatus, and smear sample preparing method202010,571,412X-ray apparatus and structure production method202010,533,958X-ray apparatus and structure production method202010,502,699X-ray apparatus and structure production method201910,145,806X-ray apparatus20189,720,009'Sample processing apparatus, sample rack set, and sample processing method'20179,529,209'Blur compensation device, lens barrel, and camera device'20169,493,058'Sunroof drain device'20168,873,172'Linear motor and lens unit'20148,704,706'Radar return signal processing apparatus and method'20148,412,370'Polishing apparatus with dressing position setting means'20137,938,999'High-strength fiber of biodegradable aliphatic polyester and process for producing the same'20117,486,407'Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, CMP polisher, and method of manufacturing semiconductor device'20097,359,069'Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, CMP polisher, and method of manufacturing semiconductor device'20086,101,156'Focus control device to perform focus control for a multi-layer recording medium'20005,978,328'Focus control device to perform focus control for a multi-layer recording medium'19995,936,924'Information recording and reproduction device'19995,856,957'Magnetic field applying device'19995,831,964'Recording medium having first tracks and second tracks at different levels and with different recording formats'19985,414,719'Operating circuit for galois field'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2020Patents assigned to NIKON CORP (12)· patent assignee history
1998–2020Based in Yokohama, JP· patent location history
2008Patents assigned to EBARA CORP (1)· patent assignee history
2011Based in Wako, JP· patent location history
2013–2014Patents assigned to TANAKA TOSHIHISA (3)· patent assignee history
2014Based in Fuchu, JP· patent location history
2016Patents assigned to AISIN SEIKI (1)· patent assignee history
2016Based in Toyota, JP· patent location history
2017–2020Patents assigned to SYSMEX CORP (2)· patent assignee history
2017–2020Based in Kobe, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NIKON CORP121998–2020
TANAKA TOSHIHISAself32013–2014
SYSMEX CORP22017–2020
AISIN SEIKI12016
EBARA CORP12008
Locations
LocationPatentsSpan
Yokohama, JP141998–2020
Kobe, JP22017–2020
Toyota, JP12016
Fuchu, JP12014
Wako, JP12011