Inventor

Ching-Bai Hwang

Inventor
Taipei, TW

Overview

63→
Patents
2001–2017
Patent span
Mechanical engineering
Primary field (CPC F)

Patents· 63 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

F04Dprimary
F04DNon-positive-displacement pumps24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
G06FElectric digital data processing14%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact11%
H05KPrinted circuits8%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application7%
LOC133%
F05DIndexing scheme for aspects relating to non-positive-displacement machines or engines, gas-turbines or jet-propulsion plants2%
F21KNon-electric light sources using luminescence2%
F21VFunctional features or details of lighting devices or systems thereof2%
PatentTitleYear
9,807,912'Heat dissipating system for data center'20179,420,730'Container data center'20169,345,167'Container data center'20168,885,346'Electronic deviec having heat dissipation device'20148,686,296'Electronic device having heat dissipation device'20148,657,471'LED lamp'20148,492,960'Lamp with heat sink and lamp cover mounted on the heat sink'20138,459,343'Thermal module assembly and heat sink assembly having at least two engageable heat sinks'20138,403,633'Cooling fan'20138,342,799'Centrifugal fan'20138,291,964'Heat sink providing redistributed airflow therethrough'20128,289,699'Heat dissipation module and electronic device having the same'20128,251,642'Centrifugal fan'20128,247,698'Electronic device and latching mechanism thereof'2012D0664102'Cooling fin'20128,215,918'Impeller and cooling fan incorporating the same'20128,152,474'Cooling fan impeller'20128,109,718'Centrifugal blower'20128,100,642'Centrifugal blower'20128,100,664'Impeller for a cooling fan'20128,092,185'Impeller and cooling fan incorporating the same'20128,092,170'Axial fan'20128,083,477'Centrifugal fan'20118,079,406'Thermal module'20118,075,276'Impeller and cooling fan incorporating the same'20118,011,878'Centrifugal fan and electronic device using same'20118,007,239'Cooling fan having protrusion at air outlet thereof'20118,007,232'Centrifugal fan and impeller thereof'20117,997,871'Impeller for a cooling fan'20117,987,898'Heat dissipation device'20117,986,521'Heat dissipation device and computer using same'20117,913,749'Thermal module with porous type heat dissipater'20117,907,397'Heat dissipating hinge for portable electronic device'20117,889,500'Portable electronic device'20117,864,525'Portable electronic device incorporating centrifugal blower'20117,839,630'Heat dissipation device and computer using same'20107,802,617'Heat dissipation apparatus'20107,779,894'Heat dissipation device'20107,744,341'Thermal module with centrifugal blower and electronic assembly incorporating the same'20107,708,521'Thermal module with centrifugal blower and electronic assembly incorporating the same'20107,701,717'Notebook computer having heat pipe'20107,688,579'Portable electronic device incorporating thermal module'20107,656,659'Notebook computer with thermal module'20107,651,601'Heat spreader with vapor chamber defined therein and method of manufacturing the same'20107,613,000'Heat dissipation device and electronic device with the same'20097,603,775'Heat spreader with vapor chamber and method of manufacturing the same'20097,606,036'Heat dissipation device'20097,568,517'Thermal module'20097,568,518'Heat sink'20097,561,417'Thermal module and fin assembly thereof'20097,520,314'Heat dissipation apparatus'20097,492,588'Heat dissipation apparatus with porous type heat dissipater'20097,447,030'Thermal module having a housing integrally formed with a roll cage of an electronic product'2008D0579883'Fan impeller'20087,434,610'Heat dissipation apparatus'2008D0575749'Fan impeller'2008D0563544'Fan impeller'20087,333,340'Mounting device for heat dissipating apparatus'20087,304,847'Heat sink'20077,193,849'Heat dissipating device'20077,136,287'Clip for mounting heat sink to circuit board'20066,973,962'Radiator with airflow guiding structure'20056,188,578'Integrated circuit package with multiple heat dissipation paths'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2013Based in Tu-Cheng, TW· patent location history
2006–2007Based in Tu-Chen, TW· patent location history
2007–2014Patents assigned to FOXCONN TECH CO LTD (57)· patent assignee history
2007–2013Patents assigned to FU ZHUN PRECISION IND SHENZHEN (27)· patent assignee history
2008–2013Based in Taipei, TW· patent location history
2008–2010Based in Guangdong, CN· patent location history
2011–2014Patents assigned to HWANG CHING-BAI (22)· patent assignee history
2011–2014Patents assigned to HUNG JUI-WEN (8)· patent assignee history
2011–2012Patents assigned to FURUI PRECISE COMPONENT KUNSHAN CO LTD (7)· patent assignee history
2012–2017Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FOXCONN TECH CO LTD572007–2014
FU ZHUN PRECISION IND SHENZHEN272007–2013
HWANG CHING-BAIself222011–2014
HUNG JUI-WEN82011–2014
FURUI PRECISE COMPONENT KUNSHAN CO LTD72011–2012
Locations
LocationPatentsSpan
Taipei, TW372008–2013
Tu-Cheng, TW132005–2013
New Taipei, TW72012–2017
Guangdong, CN32008–2010
Tu-Chen, TW22006–2007