Inventor
Ye-Fei Yu
Inventor
Shenzhen City, CN
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
F21VFunctional features or details of lighting devices or systems thereof14%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted14%
F21KNon-electric light sources using luminescence10%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
F21SNon-portable lighting devices6%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers6%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%
H10HInorganic light-emitting semiconductor devices having potential barriers4%
Y10TTechnical subjects covered by former us classification4%
PatentTitleYear
10,117,026Bone conduction speaker and compound vibration device thereof20189,402,116'Bone conduction speaker and compound vibration device thereof'20168,891,792'Bone conduction speaker and compound vibration device thereof'20148,550,781'Heat dissipation fan and rotor thereof'20138,323,002'Heat dissipation device and fan assembly thereof'20128,245,761'Heat sink'20128,122,945'Heat dissipation device with base having fasteners'20128,050,035'Heat dissipation device'20117,967,473'LED lamp with heat sink'20117,891,839'LED lamp'20117,881,061'Mounting device for mounting heat sink onto electronic component'20117,794,127'Light emitting diode having grooves to modulate light emission thereof'20107,794,118'Light emitting diode assembly'20107,746,646'Securing device for assembling heat dissipation module onto electronic component'20107,697,295'Heat sink clip'20107,679,258'Eccentric rotor and vibration motor incorporating the eccentric rotor'20107,661,853'Light emitting diode lamp'20107,654,702'LED lamp'20107,639,504'Mounting device for mounting heat sink onto electronic component'20097,611,263'Light source module with a thermoelectric cooler'20097,613,005'Mounting device for mounting heat sink onto electronic component'20097,488,093'LED lamp with a cover and a heat sink'2009D0573542'Electrical connector'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2016Based in Shenzhen City, CN· patent location history
2009–2013Patents assigned to FOXCONN TECH CO LTD (19)· patent assignee history
2009–2013Patents assigned to FU ZHUN PRECISION IND SHENZHEN (17)· patent assignee history
2012–2013Patents assigned to YU YE-FEI (4)· patent assignee history
2012–2013Patents assigned to KUO JER-HAUR (3)· patent assignee history
2014–2018Patents assigned to SHENZHEN VOXTECH CO LTD (3)· patent assignee history
2018Based in Guangdong, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FOXCONN TECH CO LTD | 19 | 2009–2013 |
| FU ZHUN PRECISION IND SHENZHEN | 17 | 2009–2013 |
| YU YE-FEIself | 4 | 2012–2013 |
| KUO JER-HAUR | 3 | 2012–2013 |
| SHENZHEN VOXTECH CO LTD | 3 | 2014–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shenzhen City, CN | 22 | 2008–2016 |
| Guangdong, CN | 1 | 2018 |