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Inventor

Shunichi Saito

Inventor
Tokyo, JP

Overview

20→
Patents
1994–2020
Patent span
Physics
Primary field (CPC G)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G11Cprimary
G11CStatic stores23%
F02DControlling combustion engines8%
G06FElectric digital data processing8%
H05KPrinted circuits8%
B25JManipulators5%
F16LPipes5%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure5%
G01MTesting static or dynamic balance of machines or structures5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use5%
PatentTitleYear
10,850,342Dissimilar-metal joining tool202010,788,985Apparatuses and methods for configurable memory array bank architectures202010,481,819Memory devices with multiple sets of latencies and methods for operating the same201910,416,041Combustion state parameter calculation method for internal combustion engine201910,372,330Apparatuses and methods for configurable memory array bank architectures201910,289,095Wire electric discharge machining system201910,049,722Apparatuses and methods for a memory device with dual common data I/O lines20189,837,137Semiconductor device20179,805,786'Apparatuses and methods for a memory device with dual common data I/O lines'20179,702,787'In-cylinder pressure detecting apparatus for internal combustion engine'20179,540,186'Conveyor system and conveyance method'20179,429,091'Fuel injection apparatus for internal combustion engine'20169,368,185'Semiconductor device'20168,422,263'Load reduced memory module and memory system including the same'20138,198,549'Multi-layer printed wiring board'20127,986,037'Low noise semiconductor device'20117,440,289'Memory module'20085,494,073'Fluid connector'1996D0359797'Pipe coupling'19955,343,892'Pipe coupling'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2013Based in Tokyo, JP· patent location history
2008–2013Patents assigned to ELPIDA MEMORY INC (4)· patent assignee history
2012–2016Patents assigned to HIRAISHI ATSUSHI (3)· patent assignee history
2016–2020Patents assigned to MICRON TECHNOLOGY INC (7)· patent assignee history
2016–2019Patents assigned to HONDA MOTOR CO LTD (3)· patent assignee history
2016–2019Based in Kanagawa, JP· patent location history
2016–2019Based in Tochigi, JP· patent location history
2017–2020Patents assigned to FANUC CORP (3)· patent assignee history
2017–2020Based in Yamanashi, JP· patent location history
2018–2020Based in Ebina, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC72016–2020
ELPIDA MEMORY INC42008–2013
FANUC CORP32017–2020
HIRAISHI ATSUSHI32012–2016
HONDA MOTOR CO LTD32016–2019
Locations
LocationPatentsSpan
Tokyo, JP71994–2013
Kanagawa, JP42016–2019
Yamanashi, JP32017–2020
Ebina, JP32018–2020
Tochigi, JP32016–2019