Inventor
Tsuyoshi Miura
Inventor
Tokyo, JP
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits12%
G11BInformation storage based on relative movement between record carrier and transducer10%
H04NPictorial communication, e.g. television10%
Y10TTechnical subjects covered by former us classification8%
H04LTransmission of digital information, e.g. telegraphic communication4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
Y02PClimate change mitigation technologies in the production or processing of goods4%
A01NPreservation of bodies of humans or animals or plants or parts thereof2%
A61KPreparations for medical, dental or toiletry purposes2%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations2%
PatentTitleYear
10,400,174Multi-layer insulated wire and method of manufacturing the same201910,068,723Switch and method for manufacturing same20189,395,054'Light source and lighting device including the same'20168,975,533'Printed wiring board, method of soldering quad flat package IC, and air conditioner'20158,586,067'Microbicidal and antiseptic gel composition'20138,534,318'Water faucet device'20138,466,364'Cable fixing member and cable fixing structure'20138,438,359'Memory management method, information processing device, program creation method, and program'20138,317,110'Water-and-hot-water mixing device'20128,309,862'Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, printed circuit board and air-conditioner'20128,305,463'Video data saving device and video data saving method'20127,710,738'Lead-type electronic-part-mounted printed circuit board, method of soldering lead-type electronic part and air-conditioner'20107,636,298'Apparatus and method for packet error correction'20097,405,945'Four-way lead flat package IC-mount printed circuit board, method of soldering four-way-lead flat package IC and air conditioner'20087,320,099'Method and apparatus for generating error correction data, and a computer-readable recording medium recording an error correction data generating program thereon'20087,202,902'Image monitor apparatus controlling camera and illumination in order to optimize luminance of picked-up image'20076,815,249'Surface-mount device and method for manufacturing the surface-mount device'20046,456,335'Multiple picture composing method and multiple picture composing apparatus'20026,259,573'Preamplifier circuit with magnetoresistive sensor ESD protection'20016,026,063'Library apparatus having interconnected cell drum and door locking mechanisms'20005,966,466'Still image encoder'19995,936,918'Library apparatus capable of rearranging of recording media'19995,757,738'Library apparatus'19984,427,446'Corrosion-resistant and abrasive wear-resistant composite material for centrifugally cast linings'1984Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2012Patents assigned to FUJITSU LTD (9)· patent assignee history
1998–2000Based in Yashiro-machi, JP· patent location history
1999–2012Based in Kawasaki, JP· patent location history
2004–2018Patents assigned to CITIZEN ELECTRONICS (3)· patent assignee history
2004–2018Based in Yamanashi, JP· patent location history
2008–2015Patents assigned to MITSUBISHI ELECTRIC CORP (4)· patent assignee history
2008–2019Based in Tokyo, JP· patent location history
2012–2015Patents assigned to MIURA TSUYOSHI (8)· patent assignee history
2012–2013Patents assigned to AOYAGI KENICHI (2)· patent assignee history
2013Based in Osaka, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 9 | 1998–2012 |
| MIURA TSUYOSHIself | 8 | 2012–2015 |
| MITSUBISHI ELECTRIC CORP | 4 | 2008–2015 |
| CITIZEN ELECTRONICS | 3 | 2004–2018 |
| AOYAGI KENICHI | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 6 | 2008–2019 |
| Kawasaki, JP | 6 | 1999–2012 |
| Yamanashi, JP | 3 | 2004–2018 |
| Yashiro-machi, JP | 3 | 1998–2000 |
| Osaka, JP | 1 | 2013 |