Inventor
Di YAO
Inventor
US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Fprimary
H01FMagnets43%
G06FElectric digital data processing14%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems14%
B30BPresses in general7%
G01NInvestigating or analysing materials by determining their chemical or physical properties7%
H04LTransmission of digital information, e.g. telegraphic communication7%
H05KPrinted circuits7%
PatentTitleYear
12,596,061Method for calibrating deformation pressure of large-volume press202612,562,308Coupled inductors for low electromagnetic interference202612,202,222Controllable rapid pressure loading technology for large volume press202512,198,844Inductors including electrically conductive standoffs202511,907,561Data backup method and apparatus202411,869,695Switching power converter assemblies including coupled inductors, and associated methods202411,756,725Boosted coupled inductors and associated systems and methods202311,615,915Low-height coupled inductors202311,575,636Method of managing processing progress of a message in a group communication interface and terminal202311,183,328Coupled inductors for low electromagnetic interference2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to MAXIM INTEGRATED PRODUCTS (6)· patent assignee history
2021–2026Based in US· patent location history
2023Patents assigned to VIVO MOBILE COMMUNICATION CO LTD (1)· patent assignee history
2023–2026Based in CN· patent location history
2024Patents assigned to HUAWEI CLOUD COMPUTING TECH CO LTD (1)· patent assignee history
2025Patents assigned to UNIV JILIN (1)· patent assignee history
2026Patents assigned to JILIN UNIV (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MAXIM INTEGRATED PRODUCTS | 6 | 2021–2026 |
| HUAWEI CLOUD COMPUTING TECH CO LTD | 1 | 2024 |
| JILIN UNIV | 1 | 2026 |
| UNIV JILIN | 1 | 2025 |
| VIVO MOBILE COMMUNICATION CO LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2021–2026 |
| CN | 4 | 2023–2026 |