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Inventor

Keiichi KASUGA

Inventor
JP

Overview

1→
Patents
2024
Patent span
Chemistry
Primary field (CPC C)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B32Bprimary
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form14%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds14%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds14%
C08JWorking-up14%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients14%
C08LCompositions of macromolecular compounds14%
H05KPrinted circuits14%
PatentTitleYear
12,168,709Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module2024

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2024Patents assigned to RESONAC CORP (1)· patent assignee history
2024Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
RESONAC CORP12024
Locations
LocationPatentsSpan
JP12024