Inventor
WEI-CHIH CHEN
Inventor
TW
Overview
Patents· 68 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges5%
H10DInorganic electric semiconductor devices4%
G06FElectric digital data processing3%
H03KPulse technique2%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use2%
G01RMeasuring electric variables2%
G06TImage data processing or generation, in general2%
PatentTitleYear
12,562,535Method for detecting undesired connection on printed circuit board202612,550,778Semiconductor package and method of forming the same202612,538,808Die and package structure202612,528,115Installation tool for self-tapping rivet fastener202612,519,024Package structure comprising buffer layer for reducing thermal stress and method of forming the same202612,500,108Bonding system and method202512,451,430Method of fabricating semiconductor devices having different architectures and semiconductor devices fabricated thereby202512,406,941Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same202512,400,876Methods of manufacture having redistribution layer using dielectric material photoactive component202512,399,545Power management watchdog202512,374,674Semiconductor structure and semiconductor device202512,332,295Wafer inspection system202512,322,688Package structure including auxiliary dielectric portion202512,293,988Semiconductor package and method of forming the same202512,283,545Package structure and method of manufacturing the same202512,242,150Electronic device202512,224,227Method for manufacturing semiconductor structure with power connecting structures under transistors and semiconductor structure with power connecting structures under transistors202512,218,009Semiconductor package and methods of forming the same202512,204,364Systems and methods for multi-phase clock generation202512,191,222Integrated fan out device with a filler-free insulating material202512,154,809Automated material handling systems202412,117,043Air-floating guide rail202412,119,235Methods of manufacture of semiconductor devices having redistribution layer using dielectric material having photoactive component202412,062,561Method for transporting wafers202411,998,776Rope based fall protection device202411,988,706Trace level voltage sensor for multi-layer printed circuit boards202411,961,777Package structure comprising buffer layer for reducing thermal stress and method of forming the same202411,948,863Package structure and method of forming the same202411,948,904Die and package structure202411,901,289Semiconductor device structure with resistive element202411,901,283Capacitor and method for forming the same202411,879,495Thermally insulating fixture202411,862,560Package structure and method of manufacturing the same202411,854,844Method of operating transport system202311,837,502Semiconductor package and methods of forming the same202311,827,730Graft copolymer and use thereof202311,817,452Method for forming decoupling capacitors between the interposing conductors and the multiple gates202311,791,313Semiconductor package and method of forming the same202311,768,516Systems and methods for multi-phase clock generation202311,739,784Method for integrally forming a stop flange on a self-tapping screw by threading dies202311,725,684Screw structure reducing wear and slip of washer202311,721,603Integrated fan out method utilizing a filler-free insulating material202311,656,492Electronic device202311,628,320Fall arrest connector202311,624,392Wing-shaped thrust screw assembly202311,609,261Wafer inspection system and wafer inspection equipment thereof202311,594,472Package structure and method of forming the same202311,550,354Systems and methods for multi-phase clock generation202311,473,609Thermal insulating screw assembly202211,467,258Computation device, sensing device and processing method based on time of flight202211,463,046Resistor-capacitor oscillator with shared circuit architecture202211,456,280Semiconductor package and method of forming the same2022D0963467Housing of cable fall arrester202211,421,812Thermally insulating fixture202211,417,582Package structure and method of manufacturing the same202211,404,342Package structure comprising buffer layer for reducing thermal stress and method of forming the same202211,404,369Semiconductor device structure with resistive element202211,367,637Method of operating transport system202211,348,817Wafer transport system and method for transporting wafers202211,342,296Semiconductor structure, semiconductor package and method of fabricating the same202211,330,416Wireless bluetooth communication mechanism capable of effectively reducing number of audio packet retransmission202211,282,804Package structure and method of manufacturing the same202211,270,927Package structure and method of forming the same202211,223,759Exposure method and image sensing device using the same202211,201,079Wafer chuck202111,174,892Screw assembly having enhanced airtight effect202111,164,839Package structure and method of manufacturing the same202111,164,814Package structure and method of manufacturing the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (42)· patent assignee history
2021–2026Patents assigned to CHEN WEI CHIH (8)· patent assignee history
2021–2026Based in TW· patent location history
2022–2024Patents assigned to YOKE IND CORP (3)· patent assignee history
2023–2025Patents assigned to CHROMA ATE INC (2)· patent assignee history
2023–2025Patents assigned to INNOLUX CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 42 | 2021–2026 |
| CHEN WEI CHIHself | 8 | 2021–2026 |
| YOKE IND CORP | 3 | 2022–2024 |
| CHROMA ATE INC | 2 | 2023–2025 |
| INNOLUX CORP | 2 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 68 | 2021–2026 |