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Inventor

Jiun-Yu Lai

Inventor
Taipei, TW

Overview

4→
Patents
2002–2019
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing67%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
PatentTitleYear
10,272,540System and method for polishing substrate20199,669,514'System and method for polishing substrate'20176,667,239'Chemical mechanical polishing of copper-oxide damascene structures'20036,458,013'Method of chemical mechanical polishing'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2003Patents assigned to ASML US INC (2)· patent assignee history
2002–2003Patents assigned to MASSACHUSETTS INST TECHNOLOGY (2)· patent assignee history
2002–2003Based in Waltham, MA, US· patent location history
2017–2019Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2017–2019Based in Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ASML US INC22002–2003
MASSACHUSETTS INST TECHNOLOGY22002–2003
TAIWAN SEMICONDUCTOR MFG CO LTD22017–2019
Locations
LocationPatentsSpan
Taipei, TW22017–2019
Waltham, Massachusetts, US22002–2003