Inventor
Emily R. Kinser
Inventor
Poughkeepsie, NY, US
Overview
Patents· 58 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
A61BDiagnosis8%
B82YSpecific uses or applications of nanostructures8%
G01NInvestigating or analysing materials by determining their chemical or physical properties7%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems6%
A61LMethods or apparatus for sterilising materials or objects in general5%
H01LSemiconductor devices5%
A61NElectrotherapy3%
C12QMeasuring or testing processes involving enzymes, nucleic acids or microorganisms3%
PatentTitleYear
11,116,877Antibacterial medical implant surface202111,077,475Neuro-chemical sensor with inhibition of fouling on nano-electrode202111,045,141Biosensor calibration structure containing different sensing surface area202111,022,577Nanopatterned biosensor electrode for enhanced sensor signal and sensitivity202111,013,437Nanopatterned biosensor electrode for enhanced sensor signal and sensitivity202111,013,908Neuro-stem cell stimulation and growth enhancement with implantable nanodevice202110,926,079Neuro-stem cell stimulation and growth enhancement with implantable nanodevice202110,918,852Neuro-stem cell stimulation and growth enhancement with implantable nanodevice202110,814,046Antibacterial medical implant surface202010,775,335Nanopatterned biosensor electrode for enhanced sensor signal and sensitivity202010,736,997Antibacterial medical implant surface202010,694,951Probe structure for physiological measurements using surface enhanced Raman spectroscopy202010,694,950Probe structure for physiological measurements using surface enhanced Raman spectroscopy202010,669,153Neuro-chemical sensor with selectively permeable membrane on nano-electrode202010,618,806Neuro-chemical sensor with selectively permeable membrane on nano-electrode202010,610,621Antibacterial medical implant surface202010,583,282Neuro-stem cell stimulation and growth enhancement with implantable nanodevice202010,583,471Neuro-chemical sensor with inhibition of fouling on nano-electrode202010,548,530Biosensor calibration structure containing different sensing surface area202010,376,193Embedded sacrificial layer to enhance biosensor stability and lifetime for nanopatterned electrodes201910,213,144Nanopatterned biosensor electrode for enhanced sensor signal and sensitivity201910,216,008Saccade and vergence tracking for distance auto focus adjustment201910,168,550Saccade and vergence tracking for distance auto focus adjustment201910,161,898Nanopatterned biosensor electrode for enhanced sensor signal and sensitivity201810,067,061Patch clamp technique with complementary raman spectroscopy20189,995,686Patch clamp technique with complementary Raman spectroscopy20189,738,517'Mold for forming complex 3D MEMS components'20179,406,561'Three dimensional integrated circuit integration using dielectric bonding first and through via formation last'20169,263,386'Forming BEOL line fuse structure'20169,257,361'In-situ thermoelectric cooling'20169,249,015'Mold for forming complex 3D MEMS components'20169,059,175'Forming BEOL line fuse structure'20158,933,562'In-situ thermoelectric cooling'20158,922,019'Semiconductor device having a copper plug'20148,871,636'Fluorine depleted adhesion layer for metal interconnect structure'20148,835,194'Leakage measurement of through silicon vias'20148,835,289'Wafer backside defectivity clean-up utilizing selective removal of substrate material'20148,771,533'Edge protection seal for bonded substrates'20148,765,597'Fluorine depleted adhesion layer for metal interconnect structure'20148,749,059'Semiconductor device having a copper plug'20148,741,769'Semiconductor device having a copper plug'20148,692,246'Leakage measurement structure having through silicon vias'20148,679,611'Edge protection seal for bonded substrates'20148,658,535'Optimized annular copper TSV'20148,610,283'Semiconductor device having a copper plug'20138,586,431'Three dimensional integration and methods of through silicon via creation'20138,569,154'Three dimensional integration and methods of through silicon via creation'20138,563,423'Fluorine depleted adhesion layer for metal interconnect structure'20138,546,961'Alignment marks to enable 3D integration'20138,492,252'Three dimensional integration and methods of through silicon via creation'20138,486,814'Wafer backside defectivity clean-up utilizing selective removal of substrate material'20138,487,425'Optimized annular copper TSV'20138,415,238'Three dimensional integration and methods of through silicon via creation'20138,399,180'Three dimensional integration with through silicon vias having multiple diameters'20138,287,980'Edge protection seal for bonded substrates'20128,039,964'Fluorine depleted adhesion layer for metal interconnect structure'20118,022,543'Underbump metallurgy for enhanced electromigration resistance'20117,910,484'Method for preventing backside defects in dielectric layers formed on semiconductor substrates'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2021Patents assigned to IBM (57)· patent assignee history
2011–2021Based in Poughkeepsie, NY, US· patent location history
2012–2016Patents assigned to FAROOQ MUKTA G (14)· patent assignee history
2012–2013Based in Hopewell Junction, NY, US· patent location history
2013–2016Patents assigned to KINSER EMILY R (13)· patent assignee history
2013Patents assigned to WISE RICHARD (4)· patent assignee history
2016–2021Patents assigned to UNIV YALE (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 57 | 2011–2021 |
| FAROOQ MUKTA G | 14 | 2012–2016 |
| KINSER EMILY Rself | 13 | 2013–2016 |
| UNIV YALE | 4 | 2016–2021 |
| WISE RICHARD | 4 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Poughkeepsie, New York, US | 52 | 2011–2021 |
| Hopewell Junction, New York, US | 6 | 2012–2013 |