Inventor
Ming-Da Cheng
Inventor
Taoyuan County, TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices41%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light6%
PatentTitleYear
11,133,285Package-on-package structure having polymer-based material for warpage control202111,121,104Method for manufacturing interconnect structure202111,101,261Package-on-package structures and methods for forming the same202111,101,233Semiconductor device and method for forming the same202111,094,655Semiconductor structure and method for forming the same202111,075,173Semiconductor device and method of forming same202111,056,474Semiconductor package, semiconductor device and method of forming the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
2021Based in Taoyuan County, TW· patent location history
2021Based in Hsinchu County, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taoyuan County, TW | 2 | 2021 |
| Hsinchu County, TW | 1 | 2021 |