Inventor
Zhicheng DING
Inventor
CN
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
A63FCard, board, or roulette games5%
G06FElectric digital data processing5%
G11CStatic stores5%
H04MTelephonic communication5%
H10BElectronic memory devices5%
PatentTitleYear
12,027,496Film in substrate for releasing z stack-up constraint202411,990,395Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement202411,894,344Power enhanced stacked chip scale package solution with integrated die attach film202411,848,281Die stack with reduced warpage202311,830,848Electronic device package202311,742,284Interconnect structure fabricated using lithographic and deposition processes202311,538,746Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same202211,302,671Power enhanced stacked chip scale package solution with integrated die attach film202211,148,044Input device for intelligent terminal2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to SHANGHAI ZHONGLIAN TECH LTD CO (1)· patent assignee history
2021–2024Based in CN· patent location history
2022–2024Patents assigned to INTEL CORP (8)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 8 | 2022–2024 |
| SHANGHAI ZHONGLIAN TECH LTD CO | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 9 | 2021–2024 |