Inventor
Yuichiro Shishido
Inventor
Ibaraki, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Jprimary
C09JAdhesives25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
Y10TTechnical subjects covered by former us classification13%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%
H01LSemiconductor devices6%
PatentTitleYear
9,105,754'Adhesive film, method of manufacturing semiconductor device, and semiconductor device'20158,779,586'Die bond film, dicing die bond film, and semiconductor device'20148,658,515'Method of manufacturing film for semiconductor device'20148,614,139'Dicing film with protecting film'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2015Patents assigned to NITTO DENKO CORP (4)· patent assignee history
2013–2014Patents assigned to SHISHIDO YUICHIRO (3)· patent assignee history
2013–2015Based in Ibaraki, JP· patent location history
2014Patents assigned to HAYASHI MIKI (1)· patent assignee history
2014Patents assigned to INOUE KOICHI (1)· patent assignee history
2014Patents assigned to INOUE KOUICHI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 4 | 2013–2015 |
| SHISHIDO YUICHIROself | 3 | 2013–2014 |
| HAYASHI MIKI | 1 | 2014 |
| INOUE KOICHI | 1 | 2014 |
| INOUE KOUICHI | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 4 | 2013–2015 |