Inventor
Markus Nopper
Inventor
Dresden, DE
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
C25DProcesses for the electrolytic or electrophoretic production of coatings11%
B24BMachines, devices, or processes for grinding or polishing6%
C23CCoating metallic material6%
C23FNon-mechanical removal of metallic material from surface3%
H01LSemiconductor devices3%
H10DInorganic electric semiconductor devices3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
8,883,610'Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines'20148,389,401'Contact elements of semiconductor devices formed on the basis of a partially applied activation layer'20138,323,471'Automatic deposition profile targeting'20128,314,494'Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices'20127,947,158'Apparatus and method for removing bubbles from a process liquid'20117,899,570'Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback'20117,781,329'Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices'20107,781,343'Semiconductor substrate having a protection layer at the substrate back side'20107,615,103'Apparatus and method for removing bubbles from a process liquid'20097,560,381'Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process'20097,517,782'Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase'20097,476,552'Method of reworking a semiconductor structure'20097,169,664'Method of reducing wafer contamination by removing under-metal layers at the wafer edge'20076,958,247'Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process'20056,951,816'Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst'20056,620,726'Method of forming metal lines having improved uniformity on a substrate'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2012Patents assigned to ADVANCED MICRO DEVICES INC (12)· patent assignee history
2003–2014Based in Dresden, DE· patent location history
2010–2014Patents assigned to GLOBALFOUNDRIES INC (4)· patent assignee history
2012–2014Patents assigned to NOPPER MARKUS (4)· patent assignee history
2012–2014Patents assigned to PREUSSE AXEL (3)· patent assignee history
2012–2014Patents assigned to SEIDEL ROBERT (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED MICRO DEVICES INC | 12 | 2003–2012 |
| GLOBALFOUNDRIES INC | 4 | 2010–2014 |
| NOPPER MARKUSself | 4 | 2012–2014 |
| PREUSSE AXEL | 3 | 2012–2014 |
| SEIDEL ROBERT | 3 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dresden, DE | 16 | 2003–2014 |