Inventor
Noriyuki Ashiwake
Inventor
Tsuchiura, JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
G06FElectric digital data processing15%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests13%
F01PCooling of machines or engines in general8%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact8%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application5%
F04BPositive-displacement machines for liquids3%
F15DFluid dynamics, i.e. methods or means for influencing the flow of gases or liquids3%
H02KDynamo-electric machines3%
H02NElectric machines not otherwise provided for3%
PatentTitleYear
6,987,668'Liquid cooling system and personal computer using thereof'20066,972,954'Liquid cooling system and personal computer using the same'20056,873,525'Liquid cooling system and personal computer using the same'20056,741,464'Liquid cooling system and personal computer using thereof'20046,697,253'Liquid cooling system and personal computer using thereof'20046,611,425'Electronic apparatus'20036,292,365'Electronic apparatus'20015,959,351'Liquid-cooled electronic device'19995,774,334'Low thermal resistant, fluid-cooled semiconductor module'19985,751,062'Cooling device of multi-chip module'1998RE035721'Cooling device of semiconductor chips'19985,705,850'Semiconductor module'19985,595,240'Cooling apparatus of electronic devices'19975,515,912'Cooling apparatus of electronic devices'19965,488,255'Cooling device for semiconductor packages, having flexible film heat expulsion means'19965,406,807'Apparatus for cooling semiconductor device and computer having the same'19955,365,400'Heat sinks and semiconductor cooling device using the heat sinks'19945,345,107'Cooling apparatus for electronic device'19945,276,586'Bonding structure of thermal conductive members for a multi-chip module'19945,270,572'Liquid impingement cooling module for semiconductor devices'19935,126,829'Cooling apparatus for electronic device'19924,770,242'Cooling device of semiconductor chips'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988–2006Patents assigned to HITACHI LTD (22)· patent assignee history
1988Based in Ibaraki, JP· patent location history
1992–2006Based in Tsuchiura, JP· patent location history
1998Based in Shimoinayoshi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 22 | 1988–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tsuchiura, JP | 20 | 1992–2006 |
| Shimoinayoshi, JP | 1 | 1998 |
| Ibaraki, JP | 1 | 1988 |