Inventor
Gosei Uemura
Inventor
Osaka, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification15%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds11%
C08LCompositions of macromolecular compounds11%
C09JAdhesives11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
B29CShaping or joining of plastics4%
B29DProducing particular articles from plastics or from substances in a plastic state4%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts4%
B29LIndexing scheme associated with subclass b29c, relating to particular articles4%
PatentTitleYear
6,010,782'Thin adhesive sheet for working semiconductor wafers'20005,714,029'Process for working a semiconductor wafer'19985,637,395'Thin adhesive sheet for working semiconductor wafers'19975,411,779'Composite tubular article and process for producing the same'19955,089,071'Process for producing a multilayered ceramic structure using an adhesive film'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992Patents assigned to NITTO ELECTRICAL IND (1)· patent assignee history
1992–2000Based in Osaka, JP· patent location history
1995Patents assigned to NITTO DENKO CORP (1)· patent assignee history
1997–2000Patents assigned to NITTO ELECTRIC IND CO (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO ELECTRIC IND CO | 3 | 1997–2000 |
| NITTO DENKO CORP | 1 | 1995 |
| NITTO ELECTRICAL IND | 1 | 1992 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 5 | 1992–2000 |