Inventor
BAMIDELE DANIEL FALOLA
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
H01LSemiconductor devices38%
C22CAlloys8%
H05KPrinted circuits8%
PatentTitleYear
12,588,499Integrated circuit heat spreader including sealant interface material202612,183,688Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE202412,166,004Solder thermal interface material (STIM) with dopant202411,817,369Lids for integrated circuit packages with solder thermal interface materials202311,798,861Integrated heat spreader (IHS) with heating element202311,670,569Channeled lids for integrated circuit packages2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to INTEL CORP (6)· patent assignee history
2023–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 6 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2023–2026 |