Inventor
Eric Peter LEWANDOWSKI
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Nprimary
G06NComputing arrangements based on specific computational models16%
H01LSemiconductor devices16%
H10NElectric solid-state devices not otherwise provided for16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
H10DInorganic electric semiconductor devices10%
B82YSpecific uses or applications of nanostructures6%
B23KSoldering or unsoldering3%
G06FElectric digital data processing3%
G11CStatic stores3%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy3%
PatentTitleYear
12,506,137High capacity compact lithium thin film battery202512,107,065Uniform chip gaps via injection-molded solder pillars202411,990,437System and method for forming solder bumps202411,895,932Selective chemical frequency modification of Josephson junction resonators202411,749,605Hybrid under-bump metallization component202311,195,799Hybrid readout package for quantum multichip bonding202111,165,010Cold-welded flip chip interconnect structure2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to IBM (7)· patent assignee history
2021–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 7 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2021–2025 |