Inventor
Tsung-Yao Chu
Inventor
Taipei, TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1088%
H10DInorganic electric semiconductor devices13%
PatentTitleYear
6,566,752'Bonding pad and method for manufacturing it'20036,459,150'Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer'20026,433,427'Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication'20026,426,555'Bonding pad and method for manufacturing it'20026,365,498'Integrated process for I/O redistribution and passive components fabrication and devices formed'20026,312,974'Simultaneous bumping/bonding process utilizing edge-type conductive pads and device fabricated'20016,197,613'Wafer level packaging method and devices formed'20015,893,731'Method for fabricating low cost integrated resistor capacitor combinations'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2003Patents assigned to IND TECH RES INST (8)· patent assignee history
1999Based in Hsinchu, TW· patent location history
2001–2003Based in Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IND TECH RES INST | 8 | 1999–2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 7 | 2001–2003 |
| Hsinchu, TW | 1 | 1999 |