Inventor
YING-YAO LAI
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices35%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H10DInorganic electric semiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
12,557,655Passive device structure stress reduction202612,417,973Semiconductor packaging structure and method for manufacturing the same202512,300,640Semiconductor device and method of manufacturing thereof202512,080,753Device structure with a redistribution layer and a buffer layer202411,961,880Metal-insulator-metal structure202411,728,295Semiconductor device and method of manufacturing thereof202311,715,756Device structure and methods of forming the same2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
2023–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2023–2026 |