Inventor
MICHAEL JUERSS
Inventor
DE
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10DInorganic electric semiconductor devices20%
PatentTitleYear
12,575,429Semiconductor package having a lead frame and a clip frame202612,255,168Electronic device with multi-layer contact and system202511,842,975Electronic device with multi-layer contact and system202311,515,244Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INFINEON TECHNOLOGIES AG (4)· patent assignee history
2022–2026Based in DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 4 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 4 | 2022–2026 |