Inventor
CHANGEUN JOO
Inventor
KR
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices41%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
PatentTitleYear
12,538,803Semiconductor package including a barrier structure covering connection pads and contacting a protruding portion of an adhesive layer202611,990,439Semiconductor package including under bump metallization pad202411,978,696Semiconductor package device202411,972,966Method of manufacturing a semiconductor package including correcting alignment error while forming redistribution wiring struture202411,961,812Semiconductor packages having vias202411,810,864Semiconductor package202311,587,898Semiconductor packages having vias202311,373,955Semiconductor package and method of manufacturing the semiconductor package202211,264,339Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (9)· patent assignee history
2022–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 9 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 9 | 2022–2026 |