Inventor
Albert H. Jeans
Inventor
Mountain View, CA, US
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices15%
B82YSpecific uses or applications of nanostructures10%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices10%
G11BInformation storage based on relative movement between record carrier and transducer10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
Y10TTechnical subjects covered by former us classification8%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
B29CShaping or joining of plastics3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
PatentTitleYear
10,401,753Roller Dampers20198,765,252'Thin film device with minimized spatial variation of local mean height'20148,269,221'Structure and method for thin film device'20128,021,935'Thin film device fabrication process using 3D template'20117,541,227'Thin film devices and methods for forming the same'20097,341,893'Structure and method for thin film device'20087,251,399'Method of making densely packed light guide ribbon'20077,111,383'Method of forming a head assembly'20067,070,406'Apparatus for embossing a flexible substrate with a pattern carried by an optically transparent compliant media'20067,071,548'Semiconductor coated with a mixture containing an adhesion promoter'20067,056,834'Forming a plurality of thin-film devices using imprint lithography'20066,808,646'Method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size'20046,762,113'Method for coating a semiconductor substrate with a mixture containing an adhesion promoter'20046,653,030'Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features'20036,639,753'Method of forming a head assembly, a head assembly, and a linear tape drive'20036,508,433'Collapsible hub assembly'20036,045,086'Method and apparatus for improved tape packing'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000Patents assigned to HEWLETT PACKARD CO (1)· patent assignee history
2000–2011Based in Mountain View, CA, US· patent location history
2003–2019Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (15)· patent assignee history
2007–2019Based in Palo Alto, CA, US· patent location history
2012–2014Patents assigned to JEANS ALBERT (2)· patent assignee history
2012–2014Patents assigned to MEI PING (2)· patent assignee history
2014Patents assigned to JACKSON WARREN (1)· patent assignee history
2014Based in Pala Alto, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HEWLETT PACKARD DEVELOPMENT CO | 15 | 2003–2019 |
| JEANS ALBERTself | 2 | 2012–2014 |
| MEI PING | 2 | 2012–2014 |
| HEWLETT PACKARD CO | 1 | 2000 |
| JACKSON WARREN | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Mountain View, California, US | 11 | 2000–2011 |
| Palo Alto, California, US | 5 | 2007–2019 |
| Pala Alto, California, US | 1 | 2014 |