Inventor
Chih-Hao Hsu
Inventor
Taipei, TW
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H10HInorganic light-emitting semiconductor devices having potential barriers11%
H10KOrganic electric solid-state devices6%
G06KGraphical data reading5%
G06VImage or video recognition or understanding5%
H01LSemiconductor devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
G02BOptical elements, systems or apparatus2%
G06FElectric digital data processing2%
H01RElectrically-conductive connections2%
PatentTitleYear
10,727,689Power outlet device and controlling method thereof202010,607,059Method for assembling fingerprint identification module202010,581,207Power outlet device and controlling method thereof202010,547,782Image sensing apparatus202010,535,203Digital dental mesh segmentation method and digital dental mesh segmentation device202010,499,523Fingerprint recognition module and manufacturing method therefor201910,446,929Antenna efficiency enhancement by active detuning of diversity antenna201910,345,147Optical package201910,315,212Rotary spraying coating system and its fixture201910,176,356Fingerprint identification module and manufacturing method thereof201910,108,842Method for assembling fingerprint identification module20189,879,848'LED illumination apparatus'20189,827,814Tire pressure monitoring device and carrier module thereof20179,806,050'Method of fabricating package structure'20179,658,250'Vertical probe device having positioning film'20179,622,674'Method and system for generating twelve-lead electrocardiogram signals using three differential voltages'20179,410,789'System and method for using electromagnet arrays to determine 3D relative position of electronic device corresponding to object'20169,093,459'Package structure having a semiconductor component embedded therein and method of fabricating the same'20158,698,166'Light emitting chip package module and light emitting chip package structure and manufacturing method thereof'20148,536,614'Nitride semiconductor light emitting device with magnetic film'20138,502,259'Light emitting device'20138,494,926'System and method for dispensing samples and computer readable recording medium'20138,207,517'Photo interrupter'20128,106,416'Light emitting device package'20127,989,818'Light emitting device with magnetic field'20117,940,775'Priority-based data message publishing method and system according to a data message chain'20117,906,786'Light emitting device'20117,899,773'Event detection and method and system'20117,858,991'Light emitting device with magnetic field'20107,767,996'Light-emitting device with magnetic field'20107,759,671'Light emitting device package'20107,457,728'Method and system for complex event processing'20087,415,391'Complex event evaluation systems and methods'20087,178,991'Optical transceiver module'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2020Patents assigned to IND TECH RES INST (12)· patent assignee history
2007–2014Based in Hsinchu, TW· patent location history
2008–2013Patents assigned to INST INFORMATION INDUSTRY (5)· patent assignee history
2008–2020Based in Taipei, TW· patent location history
2012–2015Patents assigned to HSU CHIH-HAO (7)· patent assignee history
2012–2014Patents assigned to XUAN RONG (4)· patent assignee history
2015–2017Based in Taoyuan, TW· patent location history
2018–2020Patents assigned to PRIMAX ELECTRONICS LTD (5)· patent assignee history
2019Based in New Taipei, TW· patent location history
2020Based in Kaohsiung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IND TECH RES INST | 12 | 2007–2020 |
| HSU CHIH-HAOself | 7 | 2012–2015 |
| INST INFORMATION INDUSTRY | 5 | 2008–2013 |
| PRIMAX ELECTRONICS LTD | 5 | 2018–2020 |
| XUAN RONG | 4 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 17 | 2008–2020 |
| Hsinchu, TW | 10 | 2007–2014 |
| Taoyuan, TW | 3 | 2015–2017 |
| Kaohsiung, TW | 1 | 2020 |
| New Taipei, TW | 1 | 2019 |