Inventor

Khanh Tran

Inventor

Milpitas, CA, US

Overview

13→

Patents

1994–2019

Patent span

Electricity

Primary field (CPC H)

Patents· 13 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices27%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%

H10DInorganic electric semiconductor devices20%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%

G01NInvestigating or analysing materials by determining their chemical or physical properties3%

G05BControl or regulating systems in general3%

G06FElectric digital data processing3%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%

Y02PClimate change mitigation technologies in the production or processing of goods3%

PatentTitleYear

10,211,172Wafer-based electronic component packaging2019 10,056,294Techniques for adhesive control between a substrate and a die2018 9,882,075'Light sensor with vertical diode junctions'2018 9,704,809'Fan-out and heterogeneous packaging of electronic components'2017 9,608,130'Semiconductor device having trench capacitor structure integrated therein'2017 9,520,462'Semiconductor device having capacitor integrated therein'2016 9,410,907'Methods and apparatuses for testing capacitive touch screen films'2016 9,196,672'Semiconductor device having capacitor integrated therein'2015 8,847,365'Inductors and methods for integrated circuits'2014 8,344,478'Inductors having inductor axis parallel to substrate surface'2013 7,943,473'Minimum cost method for forming high density passive capacitors for replacement of discrete board capacitors using a minimum cost 3D wafer-to-wafer modular integration scheme'2011 6,607,962'Globally planarized backend compatible thin film resistor contact/interconnect process'2003 5,283,943'Automated assembly apparatus'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2014Patents assigned to TRAN KHANH (3)· patent assignee history

1994–2016Based in Austin, TX, US· patent location history

2003–2019Patents assigned to MAXIM INTEGRATED PRODUCTS (11)· patent assignee history

2003–2019Based in Milpitas, CA, US· patent location history

2013–2014Patents assigned to BERGEMONT ALBERT (2)· patent assignee history

2013–2014Patents assigned to ELLUL JOSEPH P (2)· patent assignee history

2013–2014Patents assigned to GODSHALK EDWARD MARTIN (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MAXIM INTEGRATED PRODUCTS	11	2003–2019
TRAN KHANHself	3	1994–2014
BERGEMONT ALBERT	2	2013–2014
ELLUL JOSEPH P	2	2013–2014
GODSHALK EDWARD MARTIN	2	2013–2014

Locations

Location	Patents	Span
Milpitas, California, US	11	2003–2019
Austin, Texas, US	2	1994–2016