Inventor

Tsukasa Ohnishi

Inventor

Tokyo, JP

Overview

2006–2018

Patent span

Electricity

Primary field (CPC H)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary

B23KSoldering or unsoldering26%

C22CAlloys22%

H05KPrinted circuits14%

H01LSemiconductor devices10%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%

Y10TTechnical subjects covered by former us classification6%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%

C23CCoating metallic material3%

B22FWorking metallic powder1%

C22FChanging the physical structure of non-ferrous metals and non-ferrous alloys1%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2006–2018Patents assigned to SENJU METAL INDUSTRY CO (17)· patent assignee history

2006–2010Based in Souka, JP· patent location history

2007–2018Based in Tokyo, JP· patent location history

2012–2017Patents assigned to OHNISHI TSUKASA (9)· patent assignee history

2014–2017Patents assigned to YAMANAKA YOSHIE (5)· patent assignee history

2014–2017Patents assigned to YOSHIKAWA SHUNSAKU (5)· patent assignee history

2014–2015Based in Koshigaya, JP· patent location history

2015–2017Patents assigned to ISHIBASHI SEIKO (3)· patent assignee history

2015Based in Sapporo, JP· patent location history

Assignee and location history derived from the patent record.

Assignees

Locations