Inventor
Toshihiro Maki
Inventor
Yokohama, JP
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material16%
H01RElectrically-conductive connections12%
Y10TTechnical subjects covered by former us classification11%
C22CAlloys10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
B22FWorking metallic powder7%
H10DInorganic electric semiconductor devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein6%
C22BProduction and refining of metals4%
PatentTitleYear
11,104,188Vehicle tire-wheel assembly2021RE045481'Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same'2015RE041975'Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same'20107,153,589'Mo-W material for formation of wiring, Mo-W target and method for production thereof, and Mo-W wiring thin film'20066,976,889'Method and structure for connecting a terminal with a wire'20056,893,301'Method and structure for connecting a terminal with a wire'20056,770,817'Structure for waterproofing terminal-wire connecting portion and method of waterproofing the same'20046,749,457'Crimp terminal'20046,739,899'Method and structure for connecting a terminal with a wire'20046,734,359'Wire connecting structure and connecting method'20046,626,711'Press-clamping terminal and method of examining press-clamped condition thereof'20036,625,884'Method of determining a connection state of metal terminal and a wire'20036,352,628'Refractory metal silicide target, method of manufacturing the target, refractory metal silicide thin film, and semiconductor device'20026,329,275'Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same'20016,309,593'Refractory metal silicide target, method of manufacturing the target, refractory metal silicide thin film, and semiconductor device'20016,200,694'Mo-W material for formation of wiring, Mo-W target and method for production thereof, and Mo-W wiring thin film'20016,113,441'Metal terminal and wire connector'20005,913,100'Mo-W material for formation of wiring, Mo-W target and method for production thereof, and Mo-W wiring thin film'19995,679,983'Highly purified metal material and sputtering target using the same'19975,634,825'Electrical terminal'19975,470,527'Ti-W sputtering target and method for manufacturing same'19955,458,697'Highly purified metal material and sputtering target using the same'19955,418,071'Sputtering target and method of manufacturing the same'19955,196,916'Highly purified metal material and sputtering target using the same'1993D0324205'Connector housing'1992D0316703'Housing for an electrical connector'1991D0316704'Housing for an electrical connector'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2005Patents assigned to YAZAKI CORP (13)· patent assignee history
1991–2005Based in Shizuoka, JP· patent location history
1993–2015Patents assigned to TOSHIBA KK (13)· patent assignee history
1993–2015Based in Yokohama, JP· patent location history
1995Based in Kanagawa, JP· patent location history
2004Based in Haibara-gun, JP· patent location history
2015Patents assigned to ISHIGAMI TAKASHI (1)· patent assignee history
2015Patents assigned to MAKI TOSHIHIRO (1)· patent assignee history
2021Patents assigned to HONDA MOTOR CO LTD (1)· patent assignee history
2021Based in Wako, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 13 | 1993–2015 |
| YAZAKI CORP | 13 | 1991–2005 |
| HONDA MOTOR CO LTD | 1 | 2021 |
| ISHIGAMI TAKASHI | 1 | 2015 |
| MAKI TOSHIHIROself | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokohama, JP | 11 | 1993–2015 |
| Shizuoka, JP | 11 | 1991–2005 |
| Kanagawa, JP | 2 | 1995 |
| Wako, JP | 1 | 2021 |
| Haibara-gun, JP | 1 | 2004 |