Inventor
Kuo-Hsien Liao
Inventor
Taichung, TW
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
Y10TTechnical subjects covered by former us classification9%
H01QAntennas, i.e. radio aerials7%
H05KPrinted circuits7%
PatentTitleYear
10,784,208Semiconductor package device and method of manufacturing the same202010,431,554Semiconductor device package and method of manufacturing the same20199,984,983Semiconductor packages with thermal-enhanced conformal shielding and related methods20189,871,005'Semiconductor device package and method of manufacturing the same'20189,484,313'Semiconductor packages with thermal-enhanced conformal shielding and related methods'20169,269,673'Semiconductor device packages'20169,190,367'Semiconductor package structure and semiconductor process'20159,070,793'Semiconductor device packages having electromagnetic interference shielding and related methods'20159,007,273'Semiconductor package integrated with conformal shield and antenna'20158,786,060'Semiconductor package integrated with conformal shield and antenna'20148,704,341'Semiconductor packages with thermal dissipation structures and EMI shielding'20148,653,633'Semiconductor device packages with electromagnetic interference shielding'20148,378,466'Wafer-level semiconductor device packages with electromagnetic interference shielding'20138,247,889'Package having an inner shield and method for making the same'20128,212,339'Semiconductor device packages with electromagnetic interference shielding'20128,212,340'Chip package and manufacturing method thereof'20128,144,479'Wireless communication module'20128,039,930'Package structure for wireless communication module'20117,989,928'Semiconductor device packages with electromagnetic interference shielding'20117,787,250'Metallic cover of miniaturization module'20107,312,518'Miniaturized multi-chip module and method for manufacturing the same'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2018Based in Taichung, TW· patent location history
2010Based in Nantou County, TW· patent location history
2011–2020Patents assigned to ADVANCED SEMICONDUCTOR ENG (17)· patent assignee history
2011–2020Based in Kaohsiung, TW· patent location history
2012–2015Patents assigned to LIAO KUO-HSIEN (10)· patent assignee history
2012–2015Patents assigned to CHEN JIAN-CHENG (3)· patent assignee history
2012–2014Patents assigned to CHIU CHI-TSUNG (3)· patent assignee history
2015Patents assigned to CHAN CHI-HONG (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 17 | 2011–2020 |
| LIAO KUO-HSIENself | 10 | 2012–2015 |
| CHEN JIAN-CHENG | 3 | 2012–2015 |
| CHIU CHI-TSUNG | 3 | 2012–2014 |
| CHAN CHI-HONG | 2 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 13 | 2007–2018 |
| Kaohsiung, TW | 7 | 2011–2020 |
| Nantou County, TW | 1 | 2010 |