Inventor
Teiichi Inada
Inventor
Tsukuba, JP
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
Y10TTechnical subjects covered by former us classification17%
C09JAdhesives16%
C08LCompositions of macromolecular compounds11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H05KPrinted circuits8%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B23BTurning2%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%
PatentTitleYear
10,923,368Substrate processing apparatus, substrate processing method, and storage medium20218,840,811'Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same'20148,617,930'Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device'20138,470,115'Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device'20138,465,615'Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device'20138,119,737'Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device'20128,017,444'Adhesive sheet, semiconductor device, and process for producing semiconductor device'20118,012,580'Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device'20118,003,207'Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device'20117,968,195'Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler'20117,968,194'Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler'20117,947,779'Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer'20117,875,500'Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support'20117,772,317'Resin molding material'20107,578,891'Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device'20097,070,670'Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device'20066,838,170'Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same'20056,673,441'Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same'20046,621,170'Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film'20036,265,782'Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film'20016,184,577'Electronic component parts device'20016,090,468'Multilayer wiring board for mounting semiconductor device and method of producing the same'20005,965,269'Adhesive, adhesive film and adhesive-backed metal foil'19995,935,452'Resin composition and its use in production of multilayer printed circuit board'19995,874,009'Multilayer printed circuit board with epoxy resin and carboxylated rubber as adhesive'19995,690,837'Process for producing multilayer printed circuit board'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2014Patents assigned to HITACHI CHEMICAL CO LTD (25)· patent assignee history
1997–2003Based in Shimodate, JP· patent location history
2004–2014Based in Tsukuba, JP· patent location history
2010Based in Ibaraki, JP· patent location history
2012–2014Patents assigned to INADA TEIICHI (5)· patent assignee history
2012–2013Patents assigned to MATSUZAKI TAKAYUKI (3)· patent assignee history
2013Patents assigned to MASHINO MICHIO (3)· patent assignee history
2013Patents assigned to URUNO MICHIO (3)· patent assignee history
2021Based in Kumamoto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI CHEMICAL CO LTD | 25 | 1997–2014 |
| INADA TEIICHIself | 5 | 2012–2014 |
| MASHINO MICHIO | 3 | 2013 |
| MATSUZAKI TAKAYUKI | 3 | 2012–2013 |
| URUNO MICHIO | 3 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tsukuba, JP | 16 | 2004–2014 |
| Shimodate, JP | 8 | 1997–2003 |
| Kumamoto, JP | 1 | 2021 |
| Ibaraki, JP | 1 | 2010 |