Inventor
Giulio DiGiacomo
Inventor
Hopewell Junction, NY, US
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H05KPrinted circuits23%
B23KSoldering or unsoldering11%
Y02PClimate change mitigation technologies in the production or processing of goods9%
Y10TTechnical subjects covered by former us classification8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
C22CAlloys2%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact2%
G01RMeasuring electric variables2%
H05BElectric heating2%
PatentTitleYear
6,678,949'Process for forming a multi-level thin-film electronic packaging structure'20046,656,770'Thermal enhancement approach using solder compositions in the liquid state'20036,373,133'Multi-chip module and heat-sink cap combination'20026,329,721'Pb-In-Sn tall C-4 for fatigue enhancement'20016,281,573'Thermal enhancement approach using solder compositions in the liquid state'20016,281,452'Multi-level thin-film electronic packaging structure and related method'20016,196,443'Pb-In-Sn tall C-4 for fatigue enhancement'20016,085,831'Direct chip-cooling through liquid vaporization heat exchange'20006,025,649'Pb-In-Sn tall C-4 for fatigue enhancement'20005,981,310'Multi-chip heat-sink cap assembly'19995,950,907'Ternary solder for the enhancement of C-4 fatigue life'19995,831,336'Ternary solder for the enhancement of C-4 fatigue life'19985,539,186'Temperature controlled multi-layer module'19965,442,239'Structure and method for corrosion and stress-resistant interconnecting metallurgy'19955,420,073'Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal'19955,367,195'Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal'19945,266,522'Structure and method for corrosion and stress-resistant interconnecting metallurgy'19935,192,622'Low-cost ternary composite for use in vias in glass-ceramic structures'19935,175,609'Structure and method for corrosion and stress-resistant interconnecting metallurgy'19924,465,223'Process for brazing'19844,360,289'Pin for brazing to a substrate and improved package resulting therefrom'19824,272,722'Determination of electric current flow patterns'1981Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1981–2004Patents assigned to IBM (22)· patent assignee history
1981–1982Based in Poughkeepsie, NY, US· patent location history
1984–2004Based in Hopewell Junction, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 22 | 1981–2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hopewell Junction, New York, US | 20 | 1984–2004 |
| Poughkeepsie, New York, US | 2 | 1981–1982 |