Inventor
CHE-WEI CHEN
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices44%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
G01RMeasuring electric variables11%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation11%
PatentTitleYear
12,218,106Backside contact to improve thermal dissipation away from semiconductor devices202512,218,165Semiconductor image sensor and method of manufacturing the same202512,130,331Test interface circuit202411,756,936Backside contact to improve thermal dissipation away from semiconductor devices202311,289,455Backside contact to improve thermal dissipation away from semiconductor devices2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2022–2025Based in TW· patent location history
2024Patents assigned to NANYA TECHNOLOGY CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2022–2025 |
| NANYA TECHNOLOGY CORP | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 5 | 2022–2025 |